TESCAN AMBER X
等离子FIB和无漏磁超高分辨场发射扫描电镜的完美结合，无限扩展在材料表征领域的应用
TESCAN AMBER X 是完美结合了分析型等离子FIB和超高分辨（UHR）扫描电镜的综合分析平台，能够同时提供高效率、大面积样品刻蚀，多模态的样品表征，以及在无镓注入干扰状态下进行样品制备和改性。 TESCAN AMBER X 具备快速精确的等离子体FIB刻蚀和无漏磁超高分辨SEM成像的特性，使其成为多项研究的首选方案，例如快速制备出宽度可达1 毫米的截面; 高通量、多模态的FIB-SEM断层扫描，可快速获得三维重建图像和可视化数据; 元素化学和/或晶体取向研究; 无注入离子干扰状态下制备出微米和纳米结构，以便通过其它分析方法进行后续测试或表征等。
主要特性
- iFIB+ 氙等离子FIB镜筒
- 最大离子束流可达1 μA， 可实现超高刻蚀速率
- 分辨率 : < 15 nm
- 无与伦比的超大视野：1 mm @ 30 keV
- 快速精确的压电驱动光阑变换器
- BrightBeam™ 超高分辨SEM镜筒技术
- 无漏磁超高分辨SEM镜筒可以最大程度实现各类样品的分析和表征
- 分辨率：1.5 nm @ 1kV
- 优化的镜筒内探测器系统，进一步提高了探测能力
- 光阑优化提升了分辨率，特别是在高束流下分辨率
主要应用
- 刻蚀和抛光大横截面
在3.5小时内完成宽度达1 mm横截面的刻蚀， 然后使用TESCAN专有的摇摆样品台，以较小的离子束流抛光横截面，这样可以抑制”幕帘效应“（curtaining），同时还可以在刻蚀过程中原位监控横截面质量。
- FIB-SEM断层扫描
AMBER X 是多尺度、多模态微结构表征的最佳选择。这款等离子FIB支持快速地刻蚀和抛光样品。TESCAN用于静态3D EBSD数据采集的专利技术和嵌入式FIB-SEM层析成像模块，可以支持各种成像和分析探测器，增加了实用性，使断层扫描技术可以快速、精确且便捷地应用于各类材料的分析。
- 无镓干扰状态下的样品制备
传统镓离子 FIB加工时由于镓离子污染或注入可能导致的微观结构和/或机械性能改变。氙是一种惰性元素，所以可以实现对铝等材料进行无污染的样品制备和加工。
Application Examples（应用案例）
/AMBER-X-images/A-1-mm-wide-polished-cross-section-of-a-Li-ion-battery-electrode-using-Plasma-FIB.png.aspx?height=350 "A 1 mm wide polished cross section of a Li-ion battery electrode using Plasma FIB.")
/AMBER-X-images/A-Li-ion-battery-cross-section-polished-using-Plasma-FIB-with-curtaining-reduction-using-Rocking-Stage-and-a-thin-silicon-mask-to-suppress-the-surface-topography.png.aspx?height=350 "A Li-ion battery cross-section polished using Plasma FIB with curtaining reduction using Rocking Stage and a thin silicon mask to suppress the surface topography.")
/AMBER-X-images/A-diffusion-of-Li-from-Li-ion-battery-electrode-imaged-at-500eV-A-diffusion-of-Li-from-Li-ion-battery-electrode-imaged-at-500eV.png.aspx?height=350 "A diffusion of Li from Li-ion battery electrode imaged at 500eV.")
/AMBER-X-images/A-TEM-lamella-prepartion.png.aspx?height=350 "A TEM lamella prepartion from a Ti6Al4V alloy powder bead, used for Additive manufacturing, in order to check the oxidation layer thickness on the powder surface. The TEM lamella was prepared by Plasma FIB.")
/AMBER-X-images/An-EBSD-map-from-a-cross-section-of-a-300-%C2%B5m-diameter-Copper-wire-(prepared-using-1%C2%B5A-beam-current).png.aspx?height=350 "An EBSD map from a cross-section of a 300 µm diameter Copper wire (prepared using 1µA beam current).")
/AMBER-X-images/3D-EBSD-analysis-of-a-cold-drawn,-90-%C2%B5m-diameter-Copper-wire.png.aspx?height=350 "3D EBSD analysis of a cold-drawn, 90 µm diameter Copper wire")
/AMBER-X-images/3D-EDS-Visualization-of-precipitate-distribution-in-high-alloy-steel-prepared-by-selective-laser-melting-and-annealing-(Sample-courtesy-of-Ecole-Polytechnique-de-Montreal).png.aspx?height=350 "3D EDS Visualization of precipitate distribution in high alloy steel prepared by selective laser melting and annealing. (Sample courtesy of École Polytechnique de Montréal)")
/AMBER-X-images/A-1-mm-wide-polished-cross-section-of-a-Li-ion-battery-electrode-using-Plasma-FIB.png.aspx?width=1100 "A 1 mm wide polished cross section of a Li-ion battery electrode using Plasma FIB.")
/AMBER-X-images/A-Li-ion-battery-cross-section-polished-using-Plasma-FIB-with-curtaining-reduction-using-Rocking-Stage-and-a-thin-silicon-mask-to-suppress-the-surface-topography.png.aspx?width=1100 "A Li-ion battery cross-section polished using Plasma FIB with curtaining reduction using Rocking Stage and a thin silicon mask to suppress the surface topography.")
/AMBER-X-images/A-diffusion-of-Li-from-Li-ion-battery-electrode-imaged-at-500eV-A-diffusion-of-Li-from-Li-ion-battery-electrode-imaged-at-500eV.png.aspx?width=1100 "A diffusion of Li from Li-ion battery electrode imaged at 500eV.")
/AMBER-X-images/A-TEM-lamella-prepartion.png.aspx?width=1100 "A TEM lamella prepartion from a Ti6Al4V alloy powder bead, used for Additive manufacturing, in order to check the oxidation layer thickness on the powder surface. The TEM lamella was prepared by Plasma FIB.")
/AMBER-X-images/An-EBSD-map-from-a-cross-section-of-a-300-%C2%B5m-diameter-Copper-wire-(prepared-using-1%C2%B5A-beam-current).png.aspx?width=1100 "An EBSD map from a cross-section of a 300 µm diameter Copper wire (prepared using 1µA beam current).")
/AMBER-X-images/3D-EBSD-analysis-of-a-cold-drawn,-90-%C2%B5m-diameter-Copper-wire.png.aspx?width=1100 "3D EBSD analysis of a cold-drawn, 90 µm diameter Copper wire")
/AMBER-X-images/3D-EDS-Visualization-of-precipitate-distribution-in-high-alloy-steel-prepared-by-selective-laser-melting-and-annealing-(Sample-courtesy-of-Ecole-Polytechnique-de-Montreal).png.aspx?width=1100 "3D EDS Visualization of precipitate distribution in high alloy steel prepared by selective laser melting and annealing. (Sample courtesy of École Polytechnique de Montréal)")
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